SHENZHEN —— As an innovative driver of fine bonding materials in the global manufacturing supply chain, Shenzhen Tunsing Plastic Products Co., Ltd. has officially released the latest V1.4 version of the Product Data Sheets for its star products, DS628 and DS809 hot melt adhesive films.
In this technical update, the Tunsing engineering team utilized advanced Differential Scanning Calorimetry (DSC) and dynamic parallel-plate rheological testing to deeply deconstruct the essential thermodynamic behavior differences between these two thermoplastic modified polyurethane films. This provides manufacturing engineers across textiles, clothing, footwear, luggage, automotive interiors, and electronic accessories with an unprecedented, high-precision quantitative reference for scientific material selection.
Although both DS628 and DS809 are high-performance polyurethane-based hot melt adhesive films supported and protected by premium Glassine release paper, the strategic design differences in their molecular chains endow them with entirely distinct rheological characteristics and processing responses:
| Physical Property / Process Parameter | DS628 High Heat Resistance Film | DS809 Low Temperature & Fast Curing Film |
| Appearance / Color |
Transparent |
Milky White Semi-translucent |
| Basic Composition |
Polyurethane synthetic modification |
Polyurethane |
| Proportion / Density |
$1.18 pm 0.02text{ g/cm}^3$ |
$1.20 pm 0.02text{ g/cm}^3$ |
| Hardness (Shore A) |
$72 pm 2$ |
$97 pm 3$ |
| Melt Flow Index (MFI) |
$10 pm 5text{ cm}^3/10text{min}$ |
$37 pm 10text{ cm}^3/10text{min}$ |
| Melting Range (ISO 11357) |
105 - 125°C |
40 - 60°C |
| Activation Temperature |
116 - 157°C |
72 - 109°C |
| Recommended 1st Lamination Temp |
130°C - 170°C |
90°C - 120°C |
| Recommended 2nd Lamination Temp |
140°C - 180°C |
90°C - 130°C |
Systematic measurements using the NETZSCH DSC 214 micro-calorimeter (heating rate of $10^{circ}C/text{min}$ under a nitrogen atmosphere) and an Anton Paar rotational rheometer (dynamic parallel-plate mode) reveal highly significant variations in the microscopic thermal transition points of the two films<
